JPH0650990Y2 - リード端子部品 - Google Patents
リード端子部品Info
- Publication number
- JPH0650990Y2 JPH0650990Y2 JP5434888U JP5434888U JPH0650990Y2 JP H0650990 Y2 JPH0650990 Y2 JP H0650990Y2 JP 5434888 U JP5434888 U JP 5434888U JP 5434888 U JP5434888 U JP 5434888U JP H0650990 Y2 JPH0650990 Y2 JP H0650990Y2
- Authority
- JP
- Japan
- Prior art keywords
- tie bar
- terminals
- substrate
- lead terminal
- terminal parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5434888U JPH0650990Y2 (ja) | 1988-04-22 | 1988-04-22 | リード端子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5434888U JPH0650990Y2 (ja) | 1988-04-22 | 1988-04-22 | リード端子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01162254U JPH01162254U (en]) | 1989-11-10 |
JPH0650990Y2 true JPH0650990Y2 (ja) | 1994-12-21 |
Family
ID=31280284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5434888U Expired - Lifetime JPH0650990Y2 (ja) | 1988-04-22 | 1988-04-22 | リード端子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0650990Y2 (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6937037B2 (en) | 1995-11-09 | 2005-08-30 | Formfactor, Et Al. | Probe card assembly for contacting a device with raised contact elements |
US7601039B2 (en) | 1993-11-16 | 2009-10-13 | Formfactor, Inc. | Microelectronic contact structure and method of making same |
-
1988
- 1988-04-22 JP JP5434888U patent/JPH0650990Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7601039B2 (en) | 1993-11-16 | 2009-10-13 | Formfactor, Inc. | Microelectronic contact structure and method of making same |
US6937037B2 (en) | 1995-11-09 | 2005-08-30 | Formfactor, Et Al. | Probe card assembly for contacting a device with raised contact elements |
Also Published As
Publication number | Publication date |
---|---|
JPH01162254U (en]) | 1989-11-10 |
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